Inventor

WONG LAWRENCE D

US19 patents

⚠️ This page may combine multiple inventors who share the name “WONG LAWRENCE D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WONG LAWRENCE D

INTEL CORP

Structural reinforcement of highly porous low k dielectric films by Cu diffusion barrier structures

Air gap based low dielectric constant interconnect structure and method of making same

Method of making semiconductor device using a novel interconnect cladding layer

Structural reinforcement of highly porous low k dielectric films by ILD posts

Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials

Electron-beam treated CDO films

Mechanically reinforced highly porous low dielectric constant films

Method of forming structural reinforcement of highly porous low k dielectric films by Cu diffusion barrier structures

Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control

Method of via patterning utilizing hard mask and stripping patterning material at low temperature

Unique α-C:N:H/α-C:Nx film liner/barrier to prevent fluorine outdiffusion from α-FC chemical vapor deposition dielectric layers

Enhanced surface modification of low K carbon-doped oxide

Stabilization of low dielectric constant film with in situ capping layer

Forming dual metal complementary metal oxide semiconductor integrated circuits

Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials

Metallic sealants in transistor arrangements

Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control

Metallic sealants in transistor arrangements

WONG LAWRENCE D

Carbon nanotube semiconductor devices and deterministic nanofabrication methods