Inventor
STROUPE HUGH E
US30 patents
Patents
30 patentsUS6410459B2Jun 25, 2002
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC539 citations99
US6103636AAug 15, 2000
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC122 citations98
US5232875AAug 3, 1993
Method and apparatus for improving planarity of chemical-mechanical planarization operations
MICRON TECHNOLOGY INC397 citations97
US6472725B1Oct 29, 2002
Technique for attaching die to leads
MICRON TECHNOLOGY INC25 citations96
US6329301B1Dec 11, 2001
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC25 citations96
US6069028AMay 30, 2000
Technique for attaching die to leads
MICRON TECHNOLOGY INC28 citations96
US5945729AAug 31, 1999
Technique for attaching die to leads
MICRON TECHNOLOGY INC24 citations96
US5807767ASep 15, 1998
Technique for attaching die to leads
MICRON TECHNOLOGY INC53 citations96
US6653722B2Nov 25, 2003
Method for applying uniform pressurized film across wafer
MICRON TECHNOLOGY INC60 citations95
US6610610B2Aug 26, 2003
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC13 citations92
US6506679B2Jan 14, 2003
Deadhesion method and mechanism for wafer processing
MICRON TECHNOLOGY INC14 citations92
US6316363B1Nov 13, 2001
Deadhesion method and mechanism for wafer processing
MICRON TECHNOLOGY INC23 citations92
US6555897B2Apr 29, 2003
Assembly for attaching die to leads
MICRON TECHNOLOGY INC10 citations82
US6309913B1Oct 30, 2001
Technique for attaching die to leads
MICRON TECHNOLOGY INC12 citations82
US6307254B1Oct 23, 2001
Technique for attaching die to leads
MICRON TECHNOLOGY INC11 citations82
US7449368B2Nov 11, 2008
Technique for attaching die to leads
MICRON TECHNOLOGY INC3 citations74
US7135763B2Nov 14, 2006
Technique for attaching die to leads
MICRON TECHNOLOGY INC6 citations74
US6882032B2Apr 19, 2005
Technique for attaching die to leads
MICRON TECHNOLOGY INC3 citations74
US6889698B2May 10, 2005
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations73
US6828227B2Dec 7, 2004
Method for applying uniform pressurized film across wafer
MICRON TECHNOLOGY INC9 citations73
US6530113B2Mar 11, 2003
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC8 citations73
US6518172B1Feb 11, 2003
Method for applying uniform pressurized film across wafer
MICRON TECHNOLOGY INC12 citations73
US7244681B2Jul 17, 2007
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations72
US7307353B2Dec 11, 2007
Technique for attaching die to leads
MICRON TECHNOLOGY INC2 citations63
US6693034B2Feb 17, 2004
Deadhesion method and mechanism for wafer processing
MICRON TECHNOLOGY INC2 citations63
US6429146B2Aug 6, 2002
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC3 citations63
US8053371B2Nov 8, 2011
Apparatus and methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC0 citations52
US6656402B2Dec 2, 2003
Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC0 citations52
US6645345B2Nov 11, 2003
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC0 citations52
US6624089B2Sep 23, 2003
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC0 citations52