Inventor

TSENG WEI-TSU

US24 patents

⚠️ This page may combine multiple inventors who share the name “TSENG WEI-TSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG WEI-TSU

IBM

Selective capping of copper wiring

Copper recess process with application to selective capping and electroless plating

Selective capping of copper wiring

Copper recess process with application to selective capping and electroless plating

Low dielectric constant polymer and monomers used in their formation

Chemical planarization performance for copper/low-k interconnect structures

Maintaining uniform CMP hard mask thickness

Extended life conditioning disk

Chemical planarization performance for copper/low-k interconnect structures

Post metal chemical-mechanical planarization cleaning process

Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing

Doping of copper wiring structures in back end of line processing

Dual medium filter for ion and particle filtering during semiconductor processing

Detection and characterization of SiCOH-based dielectric materials during device fabrication

WINBOND ELECTRONICS CORP

STI process by method of in-situ multilayer dielectric deposition

Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect

Scribe line structure for preventing from damages thereof induced during fabrication

ZHANG JOHN H

Method of repairing probe pads

Dual medium filter for ion and particle filtering during semiconductor processing

Method of repairing probe pads

GLOBALFOUNDRIES INC

Cobalt plated via integration scheme

Seamless metallization contacts

NAT SCIENCE COUNCIL REPUBLIC CHINA

Chemical mechanical polishing slurry for metallic thin film

DYER THOMAS W

Doping of copper wiring structures in back end of line processing