Inventor
BERNARD DAVID L
US15 patents
⚠️ This page may combine multiple inventors who share the name “BERNARD DAVID L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUNAI ELECTRIC CO
7 patentsUS9855566B1Jan 2, 2018
Fluid ejection head and process for making a fluid ejection head structure
FUNAI ELECTRIC CO21 citations92
US10031415B1Jul 24, 2018
Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film
FUNAI ELECTRIC CO2 citations72
US11980889B2May 14, 2024
Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic component
FUNAI ELECTRIC CO0 citations62
US11666918B2Jun 6, 2023
Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic component
FUNAI ELECTRIC CO0 citations62
US11746005B2Sep 5, 2023
Deep reactive ion etching process for fluid ejection heads
FUNAI ELECTRIC CO0 citations61
US10599034B2Mar 24, 2020
Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film
FUNAI ELECTRIC CO1 citations61
US9962948B1May 8, 2018
Fluid delivery devices
FUNAI ELECTRIC CO1 citations49
LEXMARK INT INC
6 patentsUS7735952B2Jun 15, 2010
Method of bonding a micro-fluid ejection head to a support substrate
LEXMARK INT INC2 citations61
US7479203B2Jan 20, 2009
Lamination of dry film to micro-fluid ejection head substrates
LEXMARK INT INC5 citations61
US7271104B2Sep 18, 2007
Method for dry etching fluid feed slots in a silicon substrate
LEXMARK INT INC2 citations61
US7560223B2Jul 14, 2009
Fluid ejection device structures and methods therefor
LEXMARK INT INC0 citations51
US7850284B2Dec 14, 2010
Method for dry etching fluid feed slots in a silicon substrate
LEXMARK INT INC0 citations50
US7767103B2Aug 3, 2010
Micro-fluid ejection assemblies
LEXMARK INT INC0 citations50