Inventor

PAI CHING-CHUNG

TW3 patents

⚠️ This page may combine multiple inventors who share the name “PAI CHING-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

2 patents

US8658483B2Feb 25, 2014

Method of fabricating an integrated circuit device having backside bevel protection

TAIWAN SEMICONDUCTOR MFG6 citations80

US7732299B2Jun 8, 2010

Process for wafer bonding

TAIWAN SEMICONDUCTOR MFG6 citations58

HSU JUNG-TZU

1 patent

US8338242B2Dec 25, 2012

Backside bevel protection

HSU JUNG-TZU6 citations76