Inventor

CHUNG HSIN-LUNG

TW19 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG HSIN-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG HSIN-LUNG

SILICONWARE PRECISION INDUSTRIES CO LTD

Semiconductor package having metal layer

Package structure and method for fabricating the same

Method for fabricating electronic package

Electronic package structure and method for fabricating the same

Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package

Fabrication method of package having ESD and EMI preventing functions

Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages

Method of manufacturing semiconductor package

Semiconductor package and method of manufacturing the same

Fabrication method of carrier-free semiconductor package

Method for fabricating package structure

Electronic package and fabrication method thereof

Semiconductor package with shielding member and method of manufacturing the same

Semiconductor package and fabrication method thereof

Package structure and fabrication method thereof

TSAI TSUNG-HSIEN

Package structure with ESD and EMI preventing functions

Package having ESD and EMI preventing functions and fabrication method thereof

HSU TSUNG-HSIEN

Semiconductor package and fabrication method thereof

CHEN CHING-HUA

Carrier-free semiconductor package