Inventor
CHU TE-FANG
TW6 patents
Patents
6 patentsUS10566320B2Feb 18, 2020
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations68
US10181458B2Jan 15, 2019
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations64
US11527472B2Dec 13, 2022
Electronic package, supporting structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations54
US9490219B2Nov 8, 2016
Semiconductor package with shielding member and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9343401B2May 17, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9526171B2Dec 20, 2016
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations35