Inventor

FANG HAO-JU

TW6 patents

⚠️ This page may combine multiple inventors who share the name “FANG HAO-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

5 patents

US9673151B2Jun 6, 2017

Semiconductor package having metal layer

SILICONWARE PRECISION INDUSTRIES CO LTD3 citations71

US11527472B2Dec 13, 2022

Electronic package, supporting structure and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations54

US10074613B2Sep 11, 2018

Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51

US9502758B2Nov 22, 2016

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50

US9526171B2Dec 20, 2016

Package structure and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations35

HSU TSUNG-HSIEN

1 patent

US8766416B2Jul 1, 2014

Semiconductor package and fabrication method thereof

HSU TSUNG-HSIEN9 citations76