Inventor
CHUNG KUANG-NENG
TW2 patents
Patents
2 patentsUS9257394B2Feb 9, 2016
Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations57
US9526171B2Dec 20, 2016
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations35