Inventor

IIDA KIYOAKI

JP18 patents

⚠️ This page may combine multiple inventors who share the name “IIDA KIYOAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IIDA KIYOAKI

SHINKO ELECTRIC IND CO

Chip embedded substrate and method of producing the same

Conductive ball mounting apparatus and conductive ball mounting method

Method of mounting conductive ball and conductive ball mounting apparatus

Apparatus and method for arranging magnetic solder balls

Apparatus and method for arranging magnetic solder balls

Apparatus and method of mounting conductive ball

Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Chip embedded substrate and method of producing the same

Conductive ball mounting apparatus and conductive ball mounting method

Conductive ball mounting method and apparatus having a movable solder ball container

Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method

YAMANO TAKAHARU

Chip embedded substrate and method of producing the same

YAMAKAMI TAKATOYO

Electronic packaging apparatus and electronic packaging method

IIDA KIYOAKI

Substrate manufacturing method

SAKAGUCHI HIDEAKI

Conductive ball mounting apparatus having a movable conductive ball container

SUNOHARA FUMIO

Conductive ball mounting method and surplus ball removing apparatus