Inventor

KUNIMOTO YUJI

JP25 patents

⚠️ This page may combine multiple inventors who share the name “KUNIMOTO YUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUNIMOTO YUJI

SHINKO ELECTRIC IND CO

Semiconductor package and manufacturing method

Chip embedded substrate and method of producing the same

Wiring substrate and method of manufacturing the same

Wiring substrate

Wiring board, semiconductor device, and method for manufacturing wiring board

Semiconductor device

Mounting substrate

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Wiring substrate and method of manufacturing the same

Chip embedded substrate and method of producing the same

Wiring substrate, method of manufacturing the same, and semiconductor device

Wiring board

Wiring board, and semiconductor device

KUNIMOTO YUJI

Fine wiring package and method of manufacturing the same

Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same

Wiring substrate, method of manufacturing the same, and semiconductor device

Resin-sealed package and method of producing the same

Method of manufacturing semiconductor device

Semiconductor package and method of manufacturing the same

HOUSE FOOD INDUSTRIAL CO

Food material-container combination

Premix for cooking by a microwave oven and process of preparation thereof

Erectable container

YAMANO TAKAHARU

Chip embedded substrate and method of producing the same

UCHIYAMA KENTA

Wiring board with lead pins and method of producing the same