Inventor
LIM WEI FEN SUEANN
MY15 patents
Patents
15 patentsUS10784190B2Sep 22, 2020
Method of making leadframe strip
TEXAS INSTRUMENTS INC1 citations72
US10115660B2Oct 30, 2018
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
TEXAS INSTRUMENTS INC2 citations72
US11791170B2Oct 17, 2023
Universal semiconductor package molds
TEXAS INSTRUMENTS INC2 citations71
US11056462B2Jul 6, 2021
Locking dual leadframe for flip chip on leadframe packages
TEXAS INSTRUMENTS INC2 citations71
US11742263B2Aug 29, 2023
Flippable leadframe for packaged electronic system having vertically stacked chip and components
TEXAS INSTRUMENTS INC0 citations61
US11373940B2Jun 28, 2022
Method of making leadframe strip
TEXAS INSTRUMENTS INC0 citations61
US11626350B2Apr 11, 2023
Cutting a leadframe assembly with a plurality of punching tools
TEXAS INSTRUMENTS INC0 citations59
US12021011B2Jun 25, 2024
Solder surface features for integrated circuit packages
TEXAS INSTRUMENTS INC0 citations55
US11348806B2May 31, 2022
Making a flat no-lead package with exposed electroplated side lead surfaces
TEXAS INSTRUMENTS INC0 citations53
US10879154B2Dec 29, 2020
Flippable leadframe for packaged electronic system having vertically stacked chips and components
TEXAS INSTRUMENTS INC0 citations51
US10541225B2Jan 21, 2020
Methods of assembling a flip chip on a locking dual leadframe
TEXAS INSTRUMENTS INC0 citations51
US9892936B2Feb 13, 2018
Packaged semiconductor device having leadframe features preventing delamination
TEXAS INSTRUMENTS INC1 citations51
US9842807B2Dec 12, 2017
Integrated circuit assembly
TEXAS INSTRUMENTS INC0 citations51
US11502045B2Nov 15, 2022
Electronic device with step cut lead
TEXAS INSTRUMENTS INC0 citations50
US11569152B2Jan 31, 2023
Electronic device with lead pitch gap
TEXAS INSTRUMENTS INC0 citations49