Inventor

LU DAOQIANG

US89 patents

⚠️ This page may combine multiple inventors who share the name “LU DAOQIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU DAOQIANG

INTEL CORP

Integrated micro-channels for 3D through silicon architectures

Low temperature packaging apparatus and method

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

Electronic assembly with stacked IC&#39;s using two or more different connection technologies and methods of manufacture

Chip-to-chip optical interconnect

Wafer support and release in wafer processing

Wafer based optical interconnect

Electronic assemblies having a low processing temperature

Microelectronic package having chamber sealed by material including one or more intermetallic compounds

Fluxless die-to-heat spreader bonding using thermal interface material

Fluxless die-to-heat spreader bonding using thermal interface material

Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate

Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same

Adhesive with differential optical properties and its application for substrate processing

Split socket optical interconnect

Embedded on-die laser source and optical interconnect

On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device

Passively aligned optical-electrical interface

Underfill integration for optical packages

Bumpless die and heat spreader lid module bonded to bumped die carrier

Optical thumbtack

Semiconductor wafer coat layers and methods therefor

Methods including fluxless chip attach processes

Integrated micro-channels for 3D through silicon architectures

Methods and apparatus to mount a waveguide to a substrate

Apparatus and method for attaching a semiconductor die to a heat spreader

Flip-chip mountable optical connector for chip-to-chip optical interconnectability

Wafer-level bonding for mechanically reinforced ultra-thin die

Methods and apparatus to optically couple an optoelectronic chip to a waveguide

Passively aligned optical-electrical interface with microlenses

Microelectronic devices having underfill materials with improved fluxing agents

Solder deposition on wafer backside for thin-die thermal interface material

High performance amine based no-flow underfill materials for flip chip applications

Underfill integration for optical packages

Manufacturable connectorization process for optical chip-to-chip interconnects

Semiconductor wafer coat layers and methods therefor

Die warpage control

Multi-die molded substrate integrated circuit device

Wafer-level assembly of heat spreaders for dual IHS packages

Method for handling integrated circuit die

Multi-chip assembly with optically coupled die

LU DAOQIANG

Heat spreader as mechanical reinforcement for ultra-thin die

Heat spreader as mechanical reinforcement for ultra-thin die

Method of mounting an optical device

Microelectronic package having direct contact heat spreader and method of manufacturing same

HENKEL AG & CO KGAA

Ultra-violet-curable and moisture-curable adhesive composition

Optical transparent dual cure adhesives composition

NAT STARCH CHEM INVEST

Conductive and resistive materials with electrical stability for use in electronics devices

GEORGIA TECH RES INST

Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane

LI ERIC J

Semiconductor wafer coat layers and methods therefor

Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture