Inventor

BRAUNISCH HENNING

US124 patents

⚠️ This page may combine multiple inventors who share the name “BRAUNISCH HENNING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRAUNISCH HENNING

INTEL CORP

Low cost microelectronic circuit package

Wafer based optical interconnect

Integrated transformer structure and method of fabrication

Input/output package architectures, and methods of using same

Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit

Split socket optical interconnect

On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device

Passively aligned optical-electrical interface

Optical thumbtack

Thermal management of dies on a secondary side of a package

Methods and apparatus to mount a waveguide to a substrate

Reconstituted wafer assembly

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Optical I/O system using planar light-wave integrated circuit

Flip-chip mountable optical connector for chip-to-chip optical interconnectability

Methods and apparatus to optically couple an optoelectronic chip to a waveguide

Manufacturable connectorization process for optical chip-to-chip interconnects

High-density interconnects for integrated circuit packages

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Low loss and low cross talk transmission lines using shaped vias

Zero-misalignment via-pad structures

Multimode signaling on decoupled input/output and power channels

Multimode signaling on decoupled input/output and power channels

Microelectronic assemblies

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Microelectronic assemblies

Microelectronic assemblies

Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities

Multi-chip package and method of providing die-to-die interconnects in same

Electro-optical assembly including a glass bridge

Optical package

High-speed signaling interface with broadside dynamic wave coupling

Electronic package with integrated clock distribution structure

Electronic package with integrated clock distribution structure

Organic interposers for integrated circuit packages

Coreless package architecture for multi-chip opto-electronics

Zero-misalignment via-pad structures

Package-integrated microchannels

Dual-sided die packages

BRAUNISCH HENNING

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Multimode signaling on decoupled input/output and power channels

Optical connection techniques and configurations

GANESAN SANKA

Input/output package architectures

KOBRINSKY MAURO J

Optical I/O system using planar light-wave integrated circuit

ELSHERBINI ADEL A

Magnetic core inductor (MCI) structures for integrated voltage regulators

LU DAOQIANG

Method of mounting an optical device

CRAWFORD ANKUR MOHAN

Integrated inductor structure and method of fabrication

PHILIPS CORP

Method and device for processing of medical image data