Inventor
LEE MI SEON
KR8 patents
⚠️ This page may combine multiple inventors who share the name “LEE MI SEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SK HYNIX INC
7 patentsUS12046573B2Jul 23, 2024
Semiconductor die, a semiconductor die stack, and a semiconductor module
SK HYNIX INC2 citations71
US11823982B2Nov 21, 2023
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC2 citations71
US11594471B2Feb 28, 2023
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC2 citations71
US12463114B2Nov 4, 2025
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC0 citations61
US12327779B2Jun 10, 2025
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC0 citations61
US12568829B2Mar 3, 2026
Packaging device including bumps and method of manufacturing the same
SK HYNIX INC0 citations60
US12255126B2Mar 18, 2025
Semiconductor devices including substrates bonded to each other and methods for fabricating the same
SK HYNIX INC0 citations51