Inventor
KAMATH SUNDAR
US4 patents
⚠️ This page may combine multiple inventors who share the name “KAMATH SUNDAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KULICKE & SOFFA HOLDINGS INC
3 patentsUS6509529B2Jan 21, 2003
Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch
KULICKE & SOFFA HOLDINGS INC17 citations91
US6317331B1Nov 13, 2001
Wiring substrate with thermal insert
KULICKE & SOFFA HOLDINGS INC37 citations91
US6299053B1Oct 9, 2001
Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
KULICKE & SOFFA HOLDINGS INC14 citations72