Inventor
PATWARDHAN VIRAJ
US6 patents
⚠️ This page may combine multiple inventors who share the name “PATWARDHAN VIRAJ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
4 patentsUS7838991B1Nov 23, 2010
Metallurgy for copper plated wafers
NAT SEMICONDUCTOR CORP16 citations82
US7375431B1May 20, 2008
Solder bump formation in electronics packaging
NAT SEMICONDUCTOR CORP12 citations82
US7674702B1Mar 9, 2010
Solder bump formation in electronics packaging
NAT SEMICONDUCTOR CORP4 citations60
US7629246B2Dec 8, 2009
High strength solder joint formation method for wafer level packages and flip applications
NAT SEMICONDUCTOR CORP1 citations50