Inventor
LIN CHAO-YEN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHAO-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
9 patentsUS8963312B2Feb 24, 2015
Stacked chip package and method for forming the same
XINTEC INC11 citations84
US8952501B2Feb 10, 2015
Chip package and method for forming the same
XINTEC INC14 citations83
US9355975B2May 31, 2016
Chip package and method for forming the same
XINTEC INC6 citations73
US9437478B2Sep 6, 2016
Chip package and method for forming the same
XINTEC INC2 citations62
US9425134B2Aug 23, 2016
Chip package
XINTEC INC2 citations62
US9209124B2Dec 8, 2015
Chip package
XINTEC INC3 citations62
US9196594B2Nov 24, 2015
Chip package and method for forming the same
XINTEC INC1 citations61
US9030011B2May 12, 2015
Chip package and method for forming the same
XINTEC INC1 citations61
US9355970B2May 31, 2016
Chip package and method for forming the same
XINTEC INC1 citations51