Inventor
SUEN WEI-LUEN
TW17 patents
Patents
17 patentsUS8963312B2Feb 24, 2015
Stacked chip package and method for forming the same
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US8952501B2Feb 10, 2015
Chip package and method for forming the same
XINTEC INC14 citations83
US9355975B2May 31, 2016
Chip package and method for forming the same
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US9287417B2Mar 15, 2016
Semiconductor chip package and method for manufacturing thereof
XINTEC INC3 citations73
US9437478B2Sep 6, 2016
Chip package and method for forming the same
XINTEC INC2 citations62
US9425134B2Aug 23, 2016
Chip package
XINTEC INC2 citations62
US9209124B2Dec 8, 2015
Chip package
XINTEC INC3 citations62
US12473197B2Nov 18, 2025
Chip package
XINTEC INC0 citations60
US11873212B2Jan 16, 2024
Chip package and manufacturing method thereof
XINTEC INC0 citations60
US11387201B2Jul 12, 2022
Chip package and manufacturing method thereof
XINTEC INC0 citations60
US11695199B2Jul 4, 2023
Antenna device and manufacturing method thereof
XINTEC INC0 citations59
US10153237B2Dec 11, 2018
Chip package and method for forming the same
XINTEC INC1 citations52
US9780251B2Oct 3, 2017
Semiconductor structure and manufacturing method thereof
XINTEC INC0 citations51
US9640683B2May 2, 2017
Electrical contact structure with a redistribution layer connected to a stud
XINTEC INC1 citations51
US9355970B2May 31, 2016
Chip package and method for forming the same
XINTEC INC1 citations51
US9165890B2Oct 20, 2015
Chip package comprising alignment mark and method for forming the same
XINTEC INC1 citations51
US11107759B2Aug 31, 2021
Chip package and manufacturing method thereof
XINTEC INC0 citations50