Inventor
KUO YUNG-HSIN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “KUO YUNG-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KUO YUNG-HSIN
6 patentsUS8832933B2Sep 16, 2014
Method of fabricating a semiconductor test probe head
KUO YUNG-HSIN10 citations81
US9134368B2Sep 15, 2015
Contactless wafer probing with improved power supply
KUO YUNG-HSIN15 citations80
US8841931B2Sep 23, 2014
Probe card wiring structure
KUO YUNG-HSIN4 citations72
US9557370B2Jan 31, 2017
Methods of improving bump allocation for semiconductor devices and semiconductor devices with improved bump allocation
KUO YUNG-HSIN3 citations71
US8643394B2Feb 4, 2014
Non-reflow probe card structure
KUO YUNG-HSIN3 citations60
US9261534B2Feb 16, 2016
Shield pin arrangement
KUO YUNG-HSIN0 citations48
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS10541185B2Jan 21, 2020
Semiconductor devices with bump allocation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9417263B2Aug 16, 2016
Testing probe head for wafer level testing, and test probe card
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US9759745B2Sep 12, 2017
Probe card
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations65