Inventor
FU TZU-HAO
TW6 patents
Patents
6 patentsUS10438843B1Oct 8, 2019
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP12 citations80
US11450558B2Sep 20, 2022
Metal interconnect structure and method for fabricating the same
UNITED MICROELECTRONICS CORP2 citations68
US12183626B2Dec 31, 2024
Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations58
US9875927B2Jan 23, 2018
Method for forming patterns for semiconductor device
UNITED MICROELECTRONICS CORP0 citations48
US9536751B2Jan 3, 2017
Method for forming patterns for semiconductor device
UNITED MICROELECTRONICS CORP0 citations48
US10784153B2Sep 22, 2020
Metal interconnect structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations47