Inventor
MARGOMENOS ALEXANDROS
US32 patents
⚠️ This page may combine multiple inventors who share the name “MARGOMENOS ALEXANDROS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOYOTA ENG & MFG NORTH AMERICA
11 patentsUS8013784B2Sep 6, 2011
Butler matrix for 3D integrated RF front-ends
TOYOTA ENG & MFG NORTH AMERICA53 citations96
US7733265B2Jun 8, 2010
Three dimensional integrated automotive radars and methods of manufacturing the same
TOYOTA ENG & MFG NORTH AMERICA104 citations93
US8022861B2Sep 20, 2011
Dual-band antenna array and RF front-end for mm-wave imager and radar
TOYOTA ENG & MFG NORTH AMERICA33 citations92
US7855691B2Dec 21, 2010
Automotive radar using a metamaterial lens
TOYOTA ENG & MFG NORTH AMERICA31 citations92
US7830301B2Nov 9, 2010
Dual-band antenna array and RF front-end for automotive radars
TOYOTA ENG & MFG NORTH AMERICA25 citations92
US7986076B2Jul 26, 2011
Energy harvesting device
TOYOTA ENG & MFG NORTH AMERICA10 citations84
US7817097B2Oct 19, 2010
Microwave antenna and method for making same
TOYOTA ENG & MFG NORTH AMERICA8 citations84
US7990237B2Aug 2, 2011
System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
TOYOTA ENG & MFG NORTH AMERICA8 citations82
US7928919B2Apr 19, 2011
Microwave antenna and method for making same
TOYOTA ENG & MFG NORTH AMERICA6 citations74
US7797817B2Sep 21, 2010
Microwave component and method for making the same
TOYOTA ENG & MFG NORTH AMERICA3 citations62
US8378759B2Feb 19, 2013
First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between
TOYOTA ENG & MFG NORTH AMERICA4 citations60
HRL LAB LLC
7 patentsUS9385083B1Jul 5, 2016
Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
HRL LAB LLC52 citations97
US9508652B1Nov 29, 2016
Direct IC-to-package wafer level packaging with integrated thermal heat spreaders
HRL LAB LLC25 citations93
US9337124B1May 10, 2016
Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers
HRL LAB LLC34 citations93
US9837372B1Dec 5, 2017
Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
HRL LAB LLC16 citations92
US9276529B1Mar 1, 2016
High performance GaN operational amplifier with wide bandwidth and high dynamic range
HRL LAB LLC13 citations84
US10217648B1Feb 26, 2019
Fabrication of microfluidic channels in diamond
HRL LAB LLC8 citations81
US9093394B1Jul 28, 2015
Method and structure for encapsulation and interconnection of transistors
HRL LAB LLC1 citations51
INFINEON TECHNOLOGIES AG
3 patentsUS9866259B1Jan 9, 2018
Transmitter/receiver module for millimeter wave 5G MIMO communication systems
INFINEON TECHNOLOGIES AG40 citations98
US10476546B2Nov 12, 2019
Transmitter/receiver module for millimeter wave 5G MIMO communication systems
INFINEON TECHNOLOGIES AG3 citations73
US10135483B2Nov 20, 2018
Transmitter/receiver module for millimeter wave 5G MIMO communication systems
INFINEON TECHNOLOGIES AG4 citations73
MARGOMENOS ALEXANDROS
3 patentsUS8305259B2Nov 6, 2012
Dual-band antenna array and RF front-end for mm-wave imager and radar
MARGOMENOS ALEXANDROS15 citations92
US8305255B2Nov 6, 2012
Dual-band antenna array and RF front-end for MM-wave imager and radar
MARGOMENOS ALEXANDROS15 citations92
US8089327B2Jan 3, 2012
Waveguide to plural microstrip transition
MARGOMENOS ALEXANDROS37 citations91