Inventor
JENG ERIK S
TW76 patents
⚠️ This page may combine multiple inventors who share the name “JENG ERIK S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VANGUARD INT SEMICONDUCT CORP
45 patentsUS6071789AJun 6, 2000
Method for simultaneously fabricating a DRAM capacitor and metal interconnections
VANGUARD INT SEMICONDUCT CORP265 citations98
US5956594ASep 21, 1999
Method for simultaneously forming capacitor plate and metal contact structures for a high density DRAM device
VANGUARD INT SEMICONDUCT CORP106 citations98
US5792687AAug 11, 1998
Method for fabricating high density integrated circuits using oxide and polysilicon spacers
VANGUARD INT SEMICONDUCT CORP148 citations98
US5780338AJul 14, 1998
Method for manufacturing crown-shaped capacitors for dynamic random access memory integrated circuits
VANGUARD INT SEMICONDUCT CORP118 citations98
US6159839ADec 12, 2000
Method for fabricating borderless and self-aligned polysilicon and metal contact landing plugs for multilevel interconnections
VANGUARD INT SEMICONDUCT CORP146 citations97
US5895239AApr 20, 1999
Method for fabricating dynamic random access memory (DRAM) by simultaneous formation of tungsten bit lines and tungsten landing plug contacts
VANGUARD INT SEMICONDUCT CORP132 citations97
US5893734AApr 13, 1999
Method for fabricating capacitor-under-bit line (CUB) dynamic random access memory (DRAM) using tungsten landing plug contacts
VANGUARD INT SEMICONDUCT CORP112 citations97
US5817579AOct 6, 1998
Two step plasma etch method for forming self aligned contact
VANGUARD INT SEMICONDUCT CORP96 citations97
US6136643AOct 24, 2000
Method for fabricating capacitor-over-bit-line dynamic random access memory (DRAM) using self-aligned contact etching technology
VANGUARD INT SEMICONDUCT CORP76 citations96
US5834359ANov 10, 1998
Method of forming an isolation region in a semiconductor substrate
VANGUARD INT SEMICONDUCT CORP54 citations96
US5792689AAug 11, 1998
Method for manufacturing double-crown capacitors self-aligned to node contacts on dynamic random access memory
VANGUARD INT SEMICONDUCT CORP78 citations96
US5710073AJan 20, 1998
Method for forming interconnections and conductors for high density integrated circuits
VANGUARD INT SEMICONDUCT CORP67 citations96
US5677227AOct 14, 1997
Method of fabricating single crown, extendible to triple crown, stacked capacitor structures, using a self-aligned capacitor node contact
VANGUARD INT SEMICONDUCT CORP49 citations96
US6476488B1Nov 5, 2002
Method for fabricating borderless and self-aligned polysilicon and metal contact landing plugs for multilevel interconnections
VANGUARD INT SEMICONDUCT CORP49 citations94
US6080620AJun 27, 2000
Method for fabricating interconnection and capacitors of a DRAM using a simple geometry active area, self-aligned etching, and polysilicon plugs
VANGUARD INT SEMICONDUCT CORP54 citations93
US6037276AMar 14, 2000
Method for improving patterning of a conductive layer in an integrated circuit
VANGUARD INT SEMICONDUCT CORP36 citations93
US5905293AMay 18, 1999
LDD spacers in MOS devices with double spacers
VANGUARD INT SEMICONDUCT CORP33 citations93
US5804852ASep 8, 1998
Stacked capacitor DRAM structure featuring a multiple crown shaped polysilicon lower electrode
VANGUARD INT SEMICONDUCT CORP26 citations93
US5789289AAug 4, 1998
Method for fabricating vertical fin capacitor structures
VANGUARD INT SEMICONDUCT CORP51 citations93
US5763312AJun 9, 1998
Method of fabricating LDD spacers in MOS devices with double spacers and device manufactured thereby
VANGUARD INT SEMICONDUCT CORP43 citations93
US5721154AFeb 24, 1998
Method for fabricating a four fin capacitor structure
VANGUARD INT SEMICONDUCT CORP40 citations93
US5658830AAug 19, 1997
Method for fabricating interconnecting lines and contacts using conformal deposition
VANGUARD INT SEMICONDUCT CORP29 citations93
US6278189B1Aug 21, 2001
High density integrated circuits using tapered and self-aligned contacts
VANGUARD INT SEMICONDUCT CORP18 citations92
US6265296B1Jul 24, 2001
Method for forming self-aligned contacts using a hard mask
VANGUARD INT SEMICONDUCT CORP22 citations92
US6239011B1May 29, 2001
Method of self-aligned contact hole etching by fluorine-containing discharges
VANGUARD INT SEMICONDUCT CORP22 citations92
US6184081B1Feb 6, 2001
Method of fabricating a capacitor under bit line DRAM structure using contact hole liners
VANGUARD INT SEMICONDUCT CORP57 citations92
US6168987B1Jan 2, 2001
Method for fabricating crown-shaped capacitor structures
VANGUARD INT SEMICONDUCT CORP27 citations92
US6150213ANov 21, 2000
Method of forming a cob dram by using self-aligned node and bit line contact plug
VANGUARD INT SEMICONDUCT CORP26 citations92
US6140240AOct 31, 2000
Method for eliminating CMP induced microscratches
VANGUARD INT SEMICONDUCT CORP19 citations92
US6124192ASep 26, 2000
Method for fabricating ultra-small interconnections using simplified patterns and sidewall contact plugs
VANGUARD INT SEMICONDUCT CORP35 citations92
US6080662AJun 27, 2000
Method for forming multi-level contacts using a H-containing fluorocarbon chemistry
VANGUARD INT SEMICONDUCT CORP20 citations92
US6037211AMar 14, 2000
Method of fabricating contact holes in high density integrated circuits using polysilicon landing plug and self-aligned etching processes
VANGUARD INT SEMICONDUCT CORP37 citations92
US6001704ADec 14, 1999
Method of fabricating a shallow trench isolation by using oxide/oxynitride layers
VANGUARD INT SEMICONDUCT CORP22 citations92
US5972789AOct 26, 1999
Method for fabricating reduced contacts using retardation layers
VANGUARD INT SEMICONDUCT CORP19 citations92
US5962195AOct 5, 1999
Method for controlling linewidth by etching bottom anti-reflective coating
VANGUARD INT SEMICONDUCT CORP38 citations92
US5906948AMay 25, 1999
Method for etching high aspect-ratio multilevel contacts
VANGUARD INT SEMICONDUCT CORP29 citations92
US6248643B1Jun 19, 2001
Method of fabricating a self-aligned contact
VANGUARD INT SEMICONDUCT CORP25 citations91
US6235621B1May 22, 2001
Method for forming a semiconductor device
VANGUARD INT SEMICONDUCT CORP30 citations91
US5968711AOct 19, 1999
Method of dry etching A1Cu using SiN hard mask
VANGUARD INT SEMICONDUCT CORP25 citations91
US6376384B1Apr 23, 2002
Multiple etch contact etching method incorporating post contact etch etching
VANGUARD INT SEMICONDUCT CORP27 citations90
US6033962AMar 7, 2000
Method of fabricating sidewall spacers for a self-aligned contact hole
VANGUARD INT SEMICONDUCT CORP40 citations90
US5837576ANov 17, 1998
Method for forming a capacitor using a silicon oxynitride etching stop layer
VANGUARD INT SEMICONDUCT CORP30 citations89
US6565759B1May 20, 2003
Etching process
VANGUARD INT SEMICONDUCT CORP16 citations83
US6306759B1Oct 23, 2001
Method for forming self-aligned contact with liner
VANGUARD INT SEMICONDUCT CORP19 citations83
US6103588AAug 15, 2000
Method of forming a contact hole in a semiconductor device
VANGUARD INT SEMICONDUCT CORP17 citations83
APPLIED INTELLECTUAL PROPERTIE
4 patentsUS6740927B1May 25, 2004
Nonvolatile memory capable of storing multibits binary information and the method of forming the same
APPLIED INTELLECTUAL PROPERTIE56 citations96
US6903968B2Jun 7, 2005
Nonvolatile memory capable of storing multibits binary information and the method of forming the same
APPLIED INTELLECTUAL PROPERTIE19 citations92
US6885072B1Apr 26, 2005
Nonvolatile memory with undercut trapping structure
APPLIED INTELLECTUAL PROPERTIE30 citations92
US7235848B2Jun 26, 2007
Nonvolatile memory with spacer trapping structure
APPLIED INTELLECTUAL PROPERTIE16 citations84
VANGAURD INTERNATIONAL SEMICON
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