Inventor

KOH WEI H

US19 patents

⚠️ This page may combine multiple inventors who share the name “KOH WEI H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOH WEI H

GRUMMAN AEROSPACE CORP

Thin substrate micro-via interconnect

Method of forming a microcircuit via interconnect

Method for aligning high density infrared detector arrays

Infrared detector substrate with breakaway test tabs

Method for making fused high density multi-layer integrated circuit module

Microcircuit via interconnect

Infrared detector subarray with integral optical filter

Fused high density multi-layer integrated circuit module

Surround view detector focal plane

KINGSTON TECHNOLOGY CORP

High density memory card assembly

Integrated multi-chip chip scale package

Multi-level package for a memory module

Memory module and card with integrated RFID tag

Encapsulated leadframe semiconductor package for random access memory integrated circuits

Method for molding a small form factor digital memory card

Leadframe semiconductor package stand and method for making the same

EXPRESS PACKAGING SYSTEMS INC

Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

SHIU GEORGE

Waterproof USB drives and method of making

GRUNMAN AEROSPACE CORP

Method of forming a precisely spaced stack of substrate layers