Inventor
SUH JIHWAN
KR10 patents
Patents
10 patentsUS11404395B2Aug 2, 2022
Semiconductor package including underfill material layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US11721673B2Aug 8, 2023
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD3 citations71
US11244927B2Feb 8, 2022
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD4 citations71
US11955449B2Apr 9, 2024
Stacked semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11508685B2Nov 22, 2022
Stacked semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12040313B2Jul 16, 2024
Semiconductor package and a method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11764192B2Sep 19, 2023
Semiconductor package including underfill material layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11658148B2May 23, 2023
Semiconductor package and a method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11791308B2Oct 17, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11362062B2Jun 14, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59