Inventor
LEE SOYOUN
KR6 patents
Patents
6 patentsUS11404395B2Aug 2, 2022
Semiconductor package including underfill material layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US11721673B2Aug 8, 2023
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD3 citations71
US11244927B2Feb 8, 2022
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD4 citations71
US11764192B2Sep 19, 2023
Semiconductor package including underfill material layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11791308B2Oct 17, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11362062B2Jun 14, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59