Inventor
HONG JISEOK
KR16 patents
Patents
16 patentsUS11404395B2Aug 2, 2022
Semiconductor package including underfill material layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US10410916B2Sep 10, 2019
Semiconductor device
SAMSUNG ELECTRONICS CO LTD7 citations84
US11289438B2Mar 29, 2022
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD5 citations82
US11721673B2Aug 8, 2023
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD3 citations71
US11658141B2May 23, 2023
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US11244927B2Feb 8, 2022
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD4 citations71
US11158594B2Oct 26, 2021
Semiconductor packages having improved reliability in bonds between connection conductors and pads
SAMSUNG ELECTRONICS CO LTD2 citations71
US12419042B2Sep 16, 2025
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11908797B2Feb 20, 2024
Integrated circuit device having a bit line and a main insulating spacer with an extended portion
SAMSUNG ELECTRONICS CO LTD1 citations61
US11764192B2Sep 19, 2023
Semiconductor package including underfill material layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11647627B2May 9, 2023
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11251070B2Feb 15, 2022
Semiconductor device including a passivation spacer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11676925B2Jun 13, 2023
Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11557596B2Jan 17, 2023
Semiconductor memory device
SAMSUNG ELECTRONICS CO LTD1 citations60
US10790186B2Sep 29, 2020
Semiconductor device including a passivation spacer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12363891B2Jul 15, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations44