Inventor
LO CHENG-CHUNG
TW8 patents
Patents
8 patentsUS11335670B2May 17, 2022
Light emitting diode package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP3 citations70
US12563667B2Feb 24, 2026
Manufacturing method of circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations60
US11991824B2May 21, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US11923350B2Mar 5, 2024
Light emitting diode package structure
UNIMICRON TECHNOLOGY CORP0 citations59
US11837591B2Dec 5, 2023
Manufacturing method of light emitting diode package structure
UNIMICRON TECHNOLOGY CORP0 citations59
US11715715B2Aug 1, 2023
Metal bump structure and manufacturing method thereof and driving substrate
UNIMICRON TECHNOLOGY CORP0 citations48
US10070536B2Sep 4, 2018
Manufacturing method of circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations37
US9917046B2Mar 13, 2018
Manufacturing method of a circuit board having a glass film
UNIMICRON TECHNOLOGY CORP0 citations37