Inventor
SANDOH HIDEYUKI
JP9 patents
Patents
9 patentsUS11056346B2Jul 6, 2021
Wafer processing method
DISCO CORP2 citations69
US7222772B2May 29, 2007
Flip chip bonder
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US10410923B2Sep 10, 2019
Method of processing wafer
DISCO CORP1 citations58
US11894271B2Feb 6, 2024
Method of processing wafer
DISCO CORP0 citations50
US11495466B2Nov 8, 2022
Processing method of wafer
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US12341068B2Jun 24, 2025
Method of manufacturing chips
DISCO CORP0 citations48
US11628515B2Apr 18, 2023
Processing apparatus for processing workpiece
DISCO CORP0 citations48
US10083867B2Sep 25, 2018
Method of processing a wafer
DISCO CORP1 citations48
US10811458B2Oct 20, 2020
Method of processing wafer
DISCO CORP0 citations39