Inventor
HECKAMAN DOUGLAS E
US18 patents
Patents
18 patentsUS6166705ADec 26, 2000
Multi title-configured phased array antenna architecture
HARRIS CORP155 citations98
US6271799B1Aug 7, 2001
Antenna horn and associated methods
HARRIS CORP344 citations95
US4641140AFeb 3, 1987
Miniaturized microwave transmission link
HARRIS CORP65 citations95
US6130585AOct 10, 2000
Cross-over distribution scheme for canceling mutually coupled signals between adjacent stripline signal distribution networks
HARRIS CORP59 citations94
US6097260AAug 1, 2000
Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks
HARRIS CORP75 citations94
US5835062ANov 10, 1998
Flat panel-configured electronically steerable phased array antenna having spatially distributed array of fanned dipole sub-arrays controlled by triode-configured field emission control devices
HARRIS CORP57 citations94
US5023624AJun 11, 1991
Microwave chip carrier package having cover-mounted antenna element
HARRIS CORP125 citations94
US4951011AAug 21, 1990
Impedance matched plug-in package for high speed microwave integrated circuits
HARRIS CORP58 citations93
US6421012B1Jul 16, 2002
Phased array antenna having patch antenna elements with enhanced parasitic antenna element performance at millimeter wavelength radio frequency signals
HARRIS CORP28 citations92
US6266015B1Jul 24, 2001
Phased array antenna having stacked patch antenna element with single millimeter wavelength feed and microstrip quadrature-to-circular polarization circuit
HARRIS CORP24 citations90
US6483464B2Nov 19, 2002
Patch dipole array antenna including a feed line organizer body and related methods
HARRIS CORP29 citations84
US4695810ASep 22, 1987
Waffleline-configured microwave transmission link
HARRIS CORP21 citations81
US5122475AJun 16, 1992
Method of making a high speed, high density semiconductor memory package with chip level repairability
HARRIS CORP15 citations73
US5014114AMay 7, 1991
High speed, high density semiconductor memory package with chip level repairability
HARRIS CORP13 citations73
US4956621ASep 11, 1990
Three-state, two-output variable RF power divider
HARRIS CORP8 citations73
US6028494AFeb 22, 2000
High isolation cross-over for canceling mutually coupled signals between adjacent stripline signal distribution networks
HARRIS CORP13 citations72
US4851793AJul 25, 1989
Waffleline - configured transmission link
HARRIS CORP13 citations72
US4890195ADec 26, 1989
Replaceable MMIC chip carrier captured by differential thermal expansion between carrier and support housing
HARRIS CORP14 citations71