Inventor
MUI DAVID
US54 patents
⚠️ This page may combine multiple inventors who share the name “MUI DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
15 patentsUS6677242B1Jan 13, 2004
Integrated shallow trench isolation approach
APPLIED MATERIALS INC242 citations99
US6235643B1May 22, 2001
Method for etching a trench having rounded top and bottom corners in a silicon substrate
APPLIED MATERIALS INC305 citations98
US6037265AMar 14, 2000
Etchant gas and a method for etching transistor gates
APPLIED MATERIALS INC54 citations96
US6180533B1Jan 30, 2001
Method for etching a trench having rounded top corners in a silicon substrate
APPLIED MATERIALS INC71 citations94
US6911399B2Jun 28, 2005
Method of controlling critical dimension microloading of photoresist trimming process by selective sidewall polymer deposition
APPLIED MATERIALS INC29 citations93
US6458671B1Oct 1, 2002
Method of providing a shallow trench in a deep-trench device
APPLIED MATERIALS INC26 citations93
US7094613B2Aug 22, 2006
Method for controlling accuracy and repeatability of an etch process
APPLIED MATERIALS INC36 citations92
US6632321B2Oct 14, 2003
Method and apparatus for monitoring and controlling wafer fabrication process
APPLIED MATERIALS INC21 citations92
US6589879B2Jul 8, 2003
Nitride open etch process based on trifluoromethane and sulfur hexafluoride
APPLIED MATERIALS INC23 citations92
US6566270B1May 20, 2003
Integration of silicon etch and chamber cleaning processes
APPLIED MATERIALS INC31 citations92
US6653237B2Nov 25, 2003
High resist-selectivity etch for silicon trench etch applications
APPLIED MATERIALS INC13 citations83
US7250373B2Jul 31, 2007
Method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrate
APPLIED MATERIALS INC8 citations74
US6703315B2Mar 9, 2004
Method of providing a shallow trench in a deep-trench device
APPLIED MATERIALS INC6 citations74
US7262865B2Aug 28, 2007
Method and apparatus for controlling a calibration cycle or a metrology tool
APPLIED MATERIALS INC9 citations73
US6238844B1May 29, 2001
Process for depositing a plasma polymerized organosilicon photoresist film
APPLIED MATERIALS INC11 citations73
IBM
13 patentsUS6317811B1Nov 13, 2001
Method and system for reissuing load requests in a multi-stream prefetch design
IBM95 citations98
US7779232B2Aug 17, 2010
Method and apparatus for dynamically managing instruction buffer depths for non-predicted branches
IBM56 citations95
US6484220B1Nov 19, 2002
Transfer of data between processors in a multi-processor system
IBM42 citations92
US6449698B1Sep 10, 2002
Method and system for bypass prefetch data path
IBM39 citations92
US6134684AOct 17, 2000
Method and system for error detection in test units utilizing pseudo-random data
IBM31 citations92
US6510471B1Jan 21, 2003
Method for choosing device among plurality of devices based on coherncy status of device's data and if device supports higher-performance transactions
IBM7 citations72
US7529799B2May 5, 2009
Method and apparatus for transaction tag assignment and maintenance in a distributed symmetric multiprocessor system
IBM2 citations62
US7512722B2Mar 31, 2009
Method for completing a plurality of chained list DMA commands that include a fenced list DMA command element
IBM2 citations61
US7444435B2Oct 28, 2008
Non-fenced list DMA command mechanism
IBM4 citations61
US7203811B2Apr 10, 2007
Non-fenced list DMA command mechanism
IBM2 citations61
US6822486B1Nov 23, 2004
Multiplexer methods and apparatus
IBM2 citations60
US7644198B2Jan 5, 2010
DMAC translation mechanism
IBM4 citations58
US9632788B2Apr 25, 2017
Buffering instructions of a single branch, backwards short loop within a virtual loop buffer
IBM0 citations51
LAM RES AG
5 patentsUS10861719B2Dec 8, 2020
Method and apparatus for processing wafer-shaped articles
LAM RES AG2 citations71
US10720343B2Jul 21, 2020
Method and apparatus for processing wafer-shaped articles
LAM RES AG5 citations71
US10446416B2Oct 15, 2019
Method and apparatus for processing wafer-shaped articles
LAM RES AG3 citations71
US12198945B2Jan 14, 2025
Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures
LAM RES AG0 citations58
US11823892B2Nov 21, 2023
Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structures
LAM RES AG1 citations56
ZHU JI
4 patentsUS8227394B2Jul 24, 2012
Composition of a cleaning material for particle removal
ZHU JI12 citations83
US8758522B2Jun 24, 2014
Method and apparatus for removing contaminants from substrate
ZHU JI1 citations61
US8105997B2Jan 31, 2012
Composition and application of a two-phase contaminant removal medium
ZHU JI1 citations61
US8601639B2Dec 10, 2013
Apparatus for application of two-phase contaminant removal medium
ZHU JI0 citations51
HALL RONALD
3 patentsUS9052910B2Jun 9, 2015
Efficiency of short loop instruction fetch
HALL RONALD9 citations83
US9772851B2Sep 26, 2017
Retrieving instructions of a single branch, backwards short loop from a local loop buffer or virtual loop buffer
HALL RONALD0 citations51
US9395995B2Jul 19, 2016
Retrieving instructions of a single branch, backwards short loop from a virtual loop buffer
HALL RONALD1 citations51
LAM RES CORP
2 patentsASANO SHIGEHIRO
2 patentsKONIGSBURG BRIAN R
1 patentTOSHIBA AMERICA ELECTRONIC
1 patentEKANADHAM KATTAMURI
1 patentFRANCE TELECOM
1 patentKAWAGUCHI MARK NAOSHI
1 patentPENG GRANT
1 patentShowing the top 50 of 54 patents by PatentIndex Score.