P

Inventor

MUI DAVID

US54 patents
⚠️ This page may combine multiple inventors who share the name “MUI DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

15 patents
US6677242B1Jan 13, 2004

Integrated shallow trench isolation approach

APPLIED MATERIALS INC242 citations99
US6235643B1May 22, 2001

Method for etching a trench having rounded top and bottom corners in a silicon substrate

APPLIED MATERIALS INC305 citations98
US6037265AMar 14, 2000

Etchant gas and a method for etching transistor gates

APPLIED MATERIALS INC54 citations96
US6180533B1Jan 30, 2001

Method for etching a trench having rounded top corners in a silicon substrate

APPLIED MATERIALS INC71 citations94
US6911399B2Jun 28, 2005

Method of controlling critical dimension microloading of photoresist trimming process by selective sidewall polymer deposition

APPLIED MATERIALS INC29 citations93
US6458671B1Oct 1, 2002

Method of providing a shallow trench in a deep-trench device

APPLIED MATERIALS INC26 citations93
US7094613B2Aug 22, 2006

Method for controlling accuracy and repeatability of an etch process

APPLIED MATERIALS INC36 citations92
US6632321B2Oct 14, 2003

Method and apparatus for monitoring and controlling wafer fabrication process

APPLIED MATERIALS INC21 citations92
US6589879B2Jul 8, 2003

Nitride open etch process based on trifluoromethane and sulfur hexafluoride

APPLIED MATERIALS INC23 citations92
US6566270B1May 20, 2003

Integration of silicon etch and chamber cleaning processes

APPLIED MATERIALS INC31 citations92
US6653237B2Nov 25, 2003

High resist-selectivity etch for silicon trench etch applications

APPLIED MATERIALS INC13 citations83
US7250373B2Jul 31, 2007

Method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrate

APPLIED MATERIALS INC8 citations74
US6703315B2Mar 9, 2004

Method of providing a shallow trench in a deep-trench device

APPLIED MATERIALS INC6 citations74
US7262865B2Aug 28, 2007

Method and apparatus for controlling a calibration cycle or a metrology tool

APPLIED MATERIALS INC9 citations73
US6238844B1May 29, 2001

Process for depositing a plasma polymerized organosilicon photoresist film

APPLIED MATERIALS INC11 citations73

IBM

13 patents

LAM RES AG

5 patents

ZHU JI

4 patents

HALL RONALD

3 patents

LAM RES CORP

2 patents

ASANO SHIGEHIRO

2 patents

KONIGSBURG BRIAN R

1 patent

TOSHIBA AMERICA ELECTRONIC

1 patent

EKANADHAM KATTAMURI

1 patent

FRANCE TELECOM

1 patent

KAWAGUCHI MARK NAOSHI

1 patent

PENG GRANT

1 patent

Showing the top 50 of 54 patents by PatentIndex Score.