Inventor
PARK YOUNG-GEUN
KR38 patents
⚠️ This page may combine multiple inventors who share the name “PARK YOUNG-GEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS7482677B2Jan 27, 2009
Dielectric structures having high dielectric constants, and non-volatile semiconductor memory devices having the dielectric structures
SAMSUNG ELECTRONICS CO LTD88 citations98
US7517750B2Apr 14, 2009
Flash memory devices having multilayered inter-gate dielectric layers including metal oxide layers and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations84
US7354821B2Apr 8, 2008
Methods of fabricating trench capacitors with insulating layer collars in undercut regions
SAMSUNG ELECTRONICS CO LTD10 citations84
US9893142B2Feb 13, 2018
Method for manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD6 citations72
US9496328B2Nov 15, 2016
Methods of manufacturing capacitors for semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations72
US11233118B2Jan 25, 2022
Integrated circuit device having dielectric layer, and method and apparatus for manufacturing the integrated circuit device
SAMSUNG ELECTRONICS CO LTD3 citations71
US7927950B2Apr 19, 2011
Method of fabricating trap type nonvolatile memory device
SAMSUNG ELECTRONICS CO LTD6 citations63
US7635633B2Dec 22, 2009
Non-volatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations63
US7531861B2May 12, 2009
Trench capacitors with insulating layer collars in undercut regions
SAMSUNG ELECTRONICS CO LTD3 citations63
US7485585B2Feb 3, 2009
Method of forming a thin film, method of manufacturing a gate structure using the same and method of manufacturing a capacitor using the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7442981B2Oct 28, 2008
Capacitor of semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7361548B2Apr 22, 2008
Methods of forming a capacitor using an atomic layer deposition process
SAMSUNG ELECTRONICS CO LTD4 citations63
US11804518B2Oct 31, 2023
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12328865B2Jun 10, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US7682906B2Mar 23, 2010
Method of manufacturing a non-volatile memory device
SAMSUNG ELECTRONICS CO LTD0 citations52
US7648874B2Jan 19, 2010
Method of forming a dielectric structure having a high dielectric constant and method of manufacturing a semiconductor device having the dielectric structure
SAMSUNG ELECTRONICS CO LTD0 citations52
US7790591B2Sep 7, 2010
Methods of manufacturing semiconductor devices including metal oxide layers
SAMSUNG ELECTRONICS CO LTD0 citations49
MIRAE CORP
9 patentsUS7464807B2Dec 16, 2008
Transfer device of handler for testing semiconductor device
MIRAE CORP34 citations92
US7408338B2Aug 5, 2008
Handler for testing semiconductor devices
MIRAE CORP25 citations91
US7196508B2Mar 27, 2007
Handler for testing semiconductor devices
MIRAE CORP27 citations91
US6873169B1Mar 29, 2005
Carrier module for semiconductor device test handler
MIRAE CORP23 citations91
US7562923B2Jul 21, 2009
Tray transferring apparatus with gripper mechanism
MIRAE CORP18 citations80
US7253653B2Aug 7, 2007
Test tray for handler for testing semiconductor devices
MIRAE CORP9 citations73
US7170276B2Jan 30, 2007
Device for compensating for heat deviation in a modular IC test handler
MIRAE CORP9 citations73
US7061101B2Jun 13, 2006
Carrier module
MIRAE CORP3 citations61
US7429868B2Sep 30, 2008
Socket assembly for testing semiconductor device
MIRAE CORP1 citations51