Inventor
SHINADA EIICHI
JP13 patents
⚠️ This page may combine multiple inventors who share the name “SHINADA EIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
8 patentsUS6121553ASep 19, 2000
Circuit boards using heat resistant resin for adhesive layers
HITACHI CHEMICAL CO LTD157 citations97
US6042685AMar 28, 2000
Multiple wire printed circuit board and process for making the same
HITACHI CHEMICAL CO LTD66 citations96
US5486655AJan 23, 1996
Multiple wire adhesive on a multiple wire wiring board
HITACHI CHEMICAL CO LTD16 citations81
US5403869AApr 4, 1995
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
HITACHI CHEMICAL CO LTD17 citations81
US5932351AAug 3, 1999
Heat resistant resin composition and adhesive sheet using the same
HITACHI CHEMICAL CO LTD8 citations73
US5928757AJul 27, 1999
Multiple wire printed circuit board and process for making the same
HITACHI CHEMICAL CO LTD9 citations73
US5584121ADec 17, 1996
Process for producing multiple wire wiring board
HITACHI CHEMICAL CO LTD12 citations72
US7870663B2Jan 18, 2011
Method for manufacturing multilayer wiring board
HITACHI CHEMICAL CO LTD2 citations61
MASUDA KATSUYUKI
3 patentsUS10328683B2Jun 25, 2019
Adhesive agent, adhesive material using the same, and method of use thereof
MASUDA KATSUYUKI0 citations44
US9446576B2Sep 20, 2016
Adhesive agent, adhesive material using the same, and method of use thereof
MASUDA KATSUYUKI0 citations44
US10322572B2Jun 18, 2019
Adhesive agent, adhesive material using the same, and method of use thereof
MASUDA KATSUYUKI0 citations43