Inventor
TAKIKAWA TAKATOSHI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “TAKIKAWA TAKATOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO ELECTRIC INDUSTRIES
8 patentsUS5643834AJul 1, 1997
Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers
SUMITOMO ELECTRIC INDUSTRIES121 citations97
US6388273B1May 14, 2002
Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
SUMITOMO ELECTRIC INDUSTRIES21 citations92
US6183874B1Feb 6, 2001
Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
SUMITOMO ELECTRIC INDUSTRIES28 citations92
US5455453AOct 3, 1995
Plastic package type semiconductor device having a rolled metal substrate
SUMITOMO ELECTRIC INDUSTRIES40 citations92
US6371063B2Apr 16, 2002
Valve-open-close mechanism
SUMITOMO ELECTRIC INDUSTRIES15 citations84
US6534190B1Mar 18, 2003
Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
SUMITOMO ELECTRIC INDUSTRIES9 citations73
US6367439B1Apr 9, 2002
Combination body of shim and cam
SUMITOMO ELECTRIC INDUSTRIES10 citations73
US5369220ANov 29, 1994
Wiring board having laminated wiring patterns
SUMITOMO ELECTRIC INDUSTRIES15 citations73