Inventor
TOBIMATSU HIROSHI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “TOBIMATSU HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
5 patentsUS5171711ADec 15, 1992
Method of manufacturing integrated circuit devices
MITSUBISHI ELECTRIC CORP63 citations94
US5600151AFeb 4, 1997
Semiconductor device comprising a semiconductor substrate, an element formed thereon, and a stress-buffering film made of a silicone ladder resin
MITSUBISHI ELECTRIC CORP21 citations88
US6645859B1Nov 11, 2003
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP11 citations72
US6046488AApr 4, 2000
Semiconductor device having conductive layer and manufacturing method thereof
MITSUBISHI ELECTRIC CORP13 citations72
US5126828AJun 30, 1992
Wafer scale integration device
MITSUBISHI ELECTRIC CORP9 citations71
RENESAS TECH CORP
4 patentsUS7154184B2Dec 26, 2006
Interconnection structure of semiconductor device
RENESAS TECH CORP9 citations72
US7582950B2Sep 1, 2009
Semiconductor chip having gettering layer, and method for manufacturing the same
RENESAS TECH CORP3 citations61
US7489040B2Feb 10, 2009
Interconnection structure of semiconductor device
RENESAS TECH CORP0 citations50
US6759317B2Jul 6, 2004
Method of manufacturing semiconductor device having passivation film and buffer coating film
RENESAS TECH CORP1 citations50