Inventor
TRASPORTO ARNEL
SG26 patents
⚠️ This page may combine multiple inventors who share the name “TRASPORTO ARNEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
13 patentsUS7868471B2Jan 11, 2011
Integrated circuit package-in-package system with leads
STATS CHIPPAC LTD22 citations91
US7977579B2Jul 12, 2011
Multiple flip-chip integrated circuit package system
STATS CHIPPAC LTD40 citations90
US7750451B2Jul 6, 2010
Multi-chip package system with multiple substrates
STATS CHIPPAC LTD11 citations84
US9368423B2Jun 14, 2016
Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package
STATS CHIPPAC LTD10 citations83
US7777310B2Aug 17, 2010
Integrated circuit package system with integral inner lead and paddle
STATS CHIPPAC LTD7 citations74
US7541221B2Jun 2, 2009
Integrated circuit package system with leadfinger support
STATS CHIPPAC LTD5 citations74
US7449369B2Nov 11, 2008
Integrated circuit package system with multiple molding
STATS CHIPPAC LTD6 citations74
US7365417B2Apr 29, 2008
Overhang integrated circuit package system
STATS CHIPPAC LTD7 citations74
US7993939B2Aug 9, 2011
Integrated circuit package system with laminate base
STATS CHIPPAC LTD3 citations63
US7759806B2Jul 20, 2010
Integrated circuit package system with multiple device units
STATS CHIPPAC LTD5 citations63
US7671463B2Mar 2, 2010
Integrated circuit package system with ground ring
STATS CHIPPAC LTD3 citations63
US7989931B2Aug 2, 2011
Integrated circuit package system with under paddle leadfingers
STATS CHIPPAC LTD2 citations60
US9449932B2Sep 20, 2016
Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
STATS CHIPPAC LTD0 citations52
CAMACHO ZIGMUND RAMIREZ
6 patentsUS8120149B2Feb 21, 2012
Integrated circuit package system
CAMACHO ZIGMUND RAMIREZ14 citations84
US8120156B2Feb 21, 2012
Integrated circuit package system with die on base package
CAMACHO ZIGMUND RAMIREZ13 citations84
US8698294B2Apr 15, 2014
Integrated circuit package system including wide flange leadframe
CAMACHO ZIGMUND RAMIREZ2 citations63
US8633578B2Jan 21, 2014
Integrated circuit package system with laminate base
CAMACHO ZIGMUND RAMIREZ2 citations63
US8258609B2Sep 4, 2012
Integrated circuit package system with lead support
CAMACHO ZIGMUND RAMIREZ2 citations63
US8629537B2Jan 14, 2014
Padless die support integrated circuit package system
CAMACHO ZIGMUND RAMIREZ0 citations52
DO BYUNG TAI
2 patentsUS8476772B2Jul 2, 2013
Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
DO BYUNG TAI3 citations63
US9299644B1Mar 29, 2016
Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
DO BYUNG TAI0 citations52