P

Inventor

MAMITSU KUNIAKI

JP29 patents
⚠️ This page may combine multiple inventors who share the name “MAMITSU KUNIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DENSO CORP

21 patents
US6703707B1Mar 9, 2004

Semiconductor device having radiation structure

DENSO CORP151 citations98
US6693350B2Feb 17, 2004

Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure

DENSO CORP56 citations96
US6992383B2Jan 31, 2006

Semiconductor device having radiation structure

DENSO CORP30 citations95
US6960825B2Nov 1, 2005

Semiconductor device having radiation structure

DENSO CORP33 citations95
US6891265B2May 10, 2005

Semiconductor device having radiation structure

DENSO CORP34 citations95
US7145254B2Dec 5, 2006

Transfer-molded power device and method for manufacturing transfer-molded power device

DENSO CORP45 citations92
US6967404B2Nov 22, 2005

Semiconductor device having radiation structure

DENSO CORP16 citations92
US6803667B2Oct 12, 2004

Semiconductor device having a protective film

DENSO CORP22 citations92
US6798062B2Sep 28, 2004

Semiconductor device having radiation structure

DENSO CORP23 citations92
US7091603B2Aug 15, 2006

Semiconductor device

DENSO CORP13 citations84
US9070666B2Jun 30, 2015

Semiconductor device including cooler

DENSO CORP5 citations83
US7957135B2Jun 7, 2011

Semiconductor module

DENSO CORP18 citations83
US7944045B2May 17, 2011

Semiconductor module molded by resin with heat radiation plate opened outside from mold

DENSO CORP7 citations83
US7470939B2Dec 30, 2008

Semiconductor device

DENSO CORP9 citations83
US7728413B2Jun 1, 2010

Resin mold type semiconductor device

DENSO CORP10 citations80
US7239016B2Jul 3, 2007

Semiconductor device having heat radiation plate and bonding member

DENSO CORP9 citations74
US7235876B2Jun 26, 2007

Semiconductor device having metallic plate with groove

DENSO CORP8 citations73
US8957517B2Feb 17, 2015

Semiconductor device including cooler

DENSO CORP2 citations62
US8884426B2Nov 11, 2014

Semiconductor device including cooler

DENSO CORP0 citations51
US7573687B2Aug 11, 2009

Power semiconductor device

DENSO CORP0 citations42
US7345369B2Mar 18, 2008

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

DENSO CORP0 citations41

MAMITSU KUNIAKI

4 patents

FUKUTANI KEITA

2 patents

FUKUOKA DAISUKE

2 patents