Inventor
LIAO CHIEN-KO
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LIAO CHIEN-KO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS10490463B2Nov 26, 2019
Automated inspection tool
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations81
US11961770B2Apr 16, 2024
Automated inspection tool
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11430108B2Aug 30, 2022
Defect offset correction
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10852704B2Dec 1, 2020
Semiconductor equipment management method, electronic device, and non-transitory computer readable storage medium
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11842481B2Dec 12, 2023
Defect offset correction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11754989B2Sep 12, 2023
Semiconductor equipment management method, electronic device, and non-transitory computer readable storage medium
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10872794B2Dec 22, 2020
Automatic in-line inspection system
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11171065B2Nov 9, 2021
Automated inspection tool
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US10839507B2Nov 17, 2020
Defect offset correction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9811000B2Nov 7, 2017
Photolithography tool and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
SANDISK CORP
3 patentsUS7772047B2Aug 10, 2010
Method of fabricating a semiconductor die having a redistribution layer
SANDISK CORP2 citations62
US7763980B2Jul 27, 2010
Semiconductor die having a distribution layer
SANDISK CORP3 citations62
US7939944B2May 10, 2011
Semiconductor die having a redistribution layer
SANDISK CORP0 citations51