P

Inventor

KUROI TAKASHI

JP54 patents
⚠️ This page may combine multiple inventors who share the name “KUROI TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

45 patents
US5889335AMar 30, 1999

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP105 citations98
US6521527B1Feb 18, 2003

Semiconductor device and method of fabricating the same

MITSUBISHI ELECTRIC CORP45 citations96
US6274457B1Aug 14, 2001

Method for manufacturing an isolation trench having plural profile angles

MITSUBISHI ELECTRIC CORP82 citations96
US6218262B1Apr 17, 2001

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP62 citations96
US5710438AJan 20, 1998

Semiconductor device with a silicide layer

MITSUBISHI ELECTRIC CORP53 citations96
US6300664B1Oct 9, 2001

Semiconductor device and method of fabricating the same

MITSUBISHI ELECTRIC CORP33 citations93
US6232187B1May 15, 2001

Semiconductor device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP27 citations93
US6180519B1Jan 30, 2001

Method of forming a layered wiring structure including titanium silicide

MITSUBISHI ELECTRIC CORP18 citations93
US5950098ASep 7, 1999

Manufacturing method of a semiconductor device with a silicide layer

MITSUBISHI ELECTRIC CORP22 citations93
US5801425ASep 1, 1998

Semiconductor device having a wiring layer including a TISI2, film of the C49 or C54 structure

MITSUBISHI ELECTRIC CORP32 citations93
US5744845AApr 28, 1998

Complementary MOS field effect transistor with tunnel effect means

MITSUBISHI ELECTRIC CORP53 citations93
US5578507ANov 26, 1996

Method of making a semiconductor device having buried doped and gettering layers

MITSUBISHI ELECTRIC CORP22 citations93
US5455437AOct 3, 1995

Semiconductor device having crystalline defect isolation regions

MITSUBISHI ELECTRIC CORP29 citations93
US6661066B2Dec 9, 2003

Semiconductor device including inversely tapered gate electrode and manufacturing method thereof

MITSUBISHI ELECTRIC CORP23 citations92
US6541825B2Apr 1, 2003

Semiconductor device including impurity layer having continuous portions formed at different depths and method of manufacturing the same

MITSUBISHI ELECTRIC CORP21 citations92
US6503799B2Jan 7, 2003

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP29 citations92
US6482718B2Nov 19, 2002

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP27 citations92
US6265743B1Jul 24, 2001

Trench type element isolation structure

MITSUBISHI ELECTRIC CORP26 citations92
US6127737AOct 3, 2000

Semiconductor device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP39 citations92
US6034409AMar 7, 2000

Isolation trench having plural profile angles

MITSUBISHI ELECTRIC CORP40 citations92
US5683923ANov 4, 1997

Semiconductor memory device capable of electrically erasing and writing information and a manufacturing method of the same

MITSUBISHI ELECTRIC CORP25 citations92
US5446305AAug 29, 1995

Semiconductor device with double structured well

MITSUBISHI ELECTRIC CORP20 citations92
US5616401AApr 1, 1997

Oxynitride film and its formation method, and method for forming an element isolation oxide film using the oxynitride film

MITSUBISHI ELECTRIC CORP34 citations91
US5538916AJul 23, 1996

Method of manufacturing semiconductor device isolation region

MITSUBISHI ELECTRIC CORP54 citations91
US6303432B1Oct 16, 2001

Method of manufacturing a semiconductor device

MITSUBISHI ELECTRIC CORP35 citations89
US6577021B2Jun 10, 2003

Static-type semiconductor memory device

MITSUBISHI ELECTRIC CORP14 citations84
US6548871B1Apr 15, 2003

Semiconductor device achieving reduced wiring length and reduced wiring delay by forming first layer wiring and gate upper electrode in same wire layer

MITSUBISHI ELECTRIC CORP19 citations84
US6399985B2Jun 4, 2002

Semiconductor device

MITSUBISHI ELECTRIC CORP17 citations84
US6383884B1May 7, 2002

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP16 citations84
US6017800AJan 25, 2000

Semiconductor device and method of fabricating thereof

MITSUBISHI ELECTRIC CORP16 citations84
US6667221B2Dec 23, 2003

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP11 citations74
US6372604B1Apr 16, 2002

Method for forming a trench type element isolation structure and trench type element isolation structure

MITSUBISHI ELECTRIC CORP13 citations74
US6323102B1Nov 27, 2001

Method of manufacturing a semiconductor device

MITSUBISHI ELECTRIC CORP12 citations74
US6150233ANov 21, 2000

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP10 citations74
US5554883ASep 10, 1996

Semiconductor device and manufacturing method therefor

MITSUBISHI ELECTRIC CORP15 citations74
US5536665AJul 16, 1996

Method of manufacturing a semiconductor device with double structured well

MITSUBISHI ELECTRIC CORP11 citations74
US5488245AJan 30, 1996

Semiconductor memory device capable of electrically erasing and writing information

MITSUBISHI ELECTRIC CORP11 citations74
US5389563AFeb 14, 1995

Method of fabricating a bipolar transistor having a high ion concentration buried floating collector

MITSUBISHI ELECTRIC CORP13 citations74
US5341022AAug 23, 1994

Bipolar transistor having a high ion concentration buried floating collector and method of fabricating the same

MITSUBISHI ELECTRIC CORP13 citations74
US5956600ASep 21, 1999

Method of manufacturing a semiconductor device

MITSUBISHI ELECTRIC CORP13 citations72
US5688701ANov 18, 1997

Method of making semiconductor device having a plurality of impurity layers

MITSUBISHI ELECTRIC CORP6 citations72
US5543647AAug 6, 1996

Semiconductor device having a plurality of impurity layers

MITSUBISHI ELECTRIC CORP12 citations72
US6268263B1Jul 31, 2001

Method of forming a trench type element isolation in semiconductor substrate

MITSUBISHI ELECTRIC CORP6 citations63
US6162669ADec 19, 2000

Method of manufacturing a semiconductor device having an LDD structure with a recess in the source/drain region formed during removal of a damaged layer

MITSUBISHI ELECTRIC CORP5 citations63
US5932912AAug 3, 1999

Semiconductor device having LDD structure with a recess in the source/drain region which is formed during the removal of a damaged layer

MITSUBISHI ELECTRIC CORP5 citations63

RENESAS TECH CORP

5 patents

Showing the top 50 of 54 patents by PatentIndex Score.