P

Inventor

HORITA KATSUYUKI

JP47 patents
⚠️ This page may combine multiple inventors who share the name “HORITA KATSUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

23 patents
US5889335AMar 30, 1999

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP105 citations98
US6274457B1Aug 14, 2001

Method for manufacturing an isolation trench having plural profile angles

MITSUBISHI ELECTRIC CORP82 citations96
US6218262B1Apr 17, 2001

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP62 citations96
US6661066B2Dec 9, 2003

Semiconductor device including inversely tapered gate electrode and manufacturing method thereof

MITSUBISHI ELECTRIC CORP23 citations92
US6541825B2Apr 1, 2003

Semiconductor device including impurity layer having continuous portions formed at different depths and method of manufacturing the same

MITSUBISHI ELECTRIC CORP21 citations92
US6503799B2Jan 7, 2003

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP29 citations92
US6482718B2Nov 19, 2002

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP27 citations92
US6265743B1Jul 24, 2001

Trench type element isolation structure

MITSUBISHI ELECTRIC CORP26 citations92
US6127737AOct 3, 2000

Semiconductor device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP39 citations92
US6034409AMar 7, 2000

Isolation trench having plural profile angles

MITSUBISHI ELECTRIC CORP40 citations92
US6303432B1Oct 16, 2001

Method of manufacturing a semiconductor device

MITSUBISHI ELECTRIC CORP35 citations89
US6548871B1Apr 15, 2003

Semiconductor device achieving reduced wiring length and reduced wiring delay by forming first layer wiring and gate upper electrode in same wire layer

MITSUBISHI ELECTRIC CORP19 citations84
US6399985B2Jun 4, 2002

Semiconductor device

MITSUBISHI ELECTRIC CORP17 citations84
US6383884B1May 7, 2002

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP16 citations84
US6017800AJan 25, 2000

Semiconductor device and method of fabricating thereof

MITSUBISHI ELECTRIC CORP16 citations84
US6372604B1Apr 16, 2002

Method for forming a trench type element isolation structure and trench type element isolation structure

MITSUBISHI ELECTRIC CORP13 citations74
US6323102B1Nov 27, 2001

Method of manufacturing a semiconductor device

MITSUBISHI ELECTRIC CORP12 citations74
US6214695B1Apr 10, 2001

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP12 citations74
US6150233ANov 21, 2000

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP10 citations74
US6268263B1Jul 31, 2001

Method of forming a trench type element isolation in semiconductor substrate

MITSUBISHI ELECTRIC CORP6 citations63
US6162669ADec 19, 2000

Method of manufacturing a semiconductor device having an LDD structure with a recess in the source/drain region formed during removal of a damaged layer

MITSUBISHI ELECTRIC CORP5 citations63
US5932912AAug 3, 1999

Semiconductor device having LDD structure with a recess in the source/drain region which is formed during the removal of a damaged layer

MITSUBISHI ELECTRIC CORP5 citations63
US6498077B2Dec 24, 2002

Semiconductor device and method of manufacturing same

MITSUBISHI ELECTRIC CORP5 citations62

RENESAS TECH CORP

10 patents
US6777758B2Aug 17, 2004

Semiconductor device

RENESAS TECH CORP31 citations93
US6998319B2Feb 14, 2006

Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film

RENESAS TECH CORP33 citations92
US6744113B2Jun 1, 2004

Semiconductor device with element isolation using impurity-doped insulator and oxynitride film

RENESAS TECH CORP13 citations84
US6841440B2Jan 11, 2005

Semiconductor device including impurity layer having continuous portions formed at different depths and method of manufacturing the same

RENESAS TECH CORP15 citations83
US6737315B2May 18, 2004

Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate

RENESAS TECH CORP5 citations74
US6890837B2May 10, 2005

Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate

RENESAS TECH CORP4 citations63
US6707099B2Mar 16, 2004

Semiconductor device and manufacturing method thereof

RENESAS TECH CORP2 citations63
US7791163B2Sep 7, 2010

Semiconductor device and its manufacturing method

RENESAS TECH CORP5 citations62
US7691713B2Apr 6, 2010

Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film

RENESAS TECH CORP1 citations62
US7244655B2Jul 17, 2007

Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film

RENESAS TECH CORP0 citations52

RENESAS ELECTRONICS CORP

9 patents

HORITA KATSUYUKI

2 patents

KADOSHIMA MASARU

1 patent

SHINOHARA HIROFUMI

1 patent

ISHIBASHI MASATO

1 patent