Inventor
HORITA KATSUYUKI
JP47 patents
⚠️ This page may combine multiple inventors who share the name “HORITA KATSUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
23 patentsUS5889335AMar 30, 1999
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP105 citations98
US6274457B1Aug 14, 2001
Method for manufacturing an isolation trench having plural profile angles
MITSUBISHI ELECTRIC CORP82 citations96
US6218262B1Apr 17, 2001
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP62 citations96
US6661066B2Dec 9, 2003
Semiconductor device including inversely tapered gate electrode and manufacturing method thereof
MITSUBISHI ELECTRIC CORP23 citations92
US6541825B2Apr 1, 2003
Semiconductor device including impurity layer having continuous portions formed at different depths and method of manufacturing the same
MITSUBISHI ELECTRIC CORP21 citations92
US6503799B2Jan 7, 2003
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP29 citations92
US6482718B2Nov 19, 2002
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP27 citations92
US6265743B1Jul 24, 2001
Trench type element isolation structure
MITSUBISHI ELECTRIC CORP26 citations92
US6127737AOct 3, 2000
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP39 citations92
US6034409AMar 7, 2000
Isolation trench having plural profile angles
MITSUBISHI ELECTRIC CORP40 citations92
US6303432B1Oct 16, 2001
Method of manufacturing a semiconductor device
MITSUBISHI ELECTRIC CORP35 citations89
US6548871B1Apr 15, 2003
Semiconductor device achieving reduced wiring length and reduced wiring delay by forming first layer wiring and gate upper electrode in same wire layer
MITSUBISHI ELECTRIC CORP19 citations84
US6399985B2Jun 4, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP17 citations84
US6383884B1May 7, 2002
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP16 citations84
US6017800AJan 25, 2000
Semiconductor device and method of fabricating thereof
MITSUBISHI ELECTRIC CORP16 citations84
US6372604B1Apr 16, 2002
Method for forming a trench type element isolation structure and trench type element isolation structure
MITSUBISHI ELECTRIC CORP13 citations74
US6323102B1Nov 27, 2001
Method of manufacturing a semiconductor device
MITSUBISHI ELECTRIC CORP12 citations74
US6214695B1Apr 10, 2001
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP12 citations74
US6150233ANov 21, 2000
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP10 citations74
US6268263B1Jul 31, 2001
Method of forming a trench type element isolation in semiconductor substrate
MITSUBISHI ELECTRIC CORP6 citations63
US6162669ADec 19, 2000
Method of manufacturing a semiconductor device having an LDD structure with a recess in the source/drain region formed during removal of a damaged layer
MITSUBISHI ELECTRIC CORP5 citations63
US5932912AAug 3, 1999
Semiconductor device having LDD structure with a recess in the source/drain region which is formed during the removal of a damaged layer
MITSUBISHI ELECTRIC CORP5 citations63
US6498077B2Dec 24, 2002
Semiconductor device and method of manufacturing same
MITSUBISHI ELECTRIC CORP5 citations62
RENESAS TECH CORP
10 patentsUS6777758B2Aug 17, 2004
Semiconductor device
RENESAS TECH CORP31 citations93
US6998319B2Feb 14, 2006
Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film
RENESAS TECH CORP33 citations92
US6744113B2Jun 1, 2004
Semiconductor device with element isolation using impurity-doped insulator and oxynitride film
RENESAS TECH CORP13 citations84
US6841440B2Jan 11, 2005
Semiconductor device including impurity layer having continuous portions formed at different depths and method of manufacturing the same
RENESAS TECH CORP15 citations83
US6737315B2May 18, 2004
Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate
RENESAS TECH CORP5 citations74
US6890837B2May 10, 2005
Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate
RENESAS TECH CORP4 citations63
US6707099B2Mar 16, 2004
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP2 citations63
US7791163B2Sep 7, 2010
Semiconductor device and its manufacturing method
RENESAS TECH CORP5 citations62
US7691713B2Apr 6, 2010
Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film
RENESAS TECH CORP1 citations62
US7244655B2Jul 17, 2007
Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film
RENESAS TECH CORP0 citations52
RENESAS ELECTRONICS CORP
9 patentsUS8384187B2Feb 26, 2013
Semiconductor device with shallow trench isolation
RENESAS ELECTRONICS CORP6 citations83
US9343527B2May 17, 2016
Semiconductor device including an isolation film buried in a groove
RENESAS ELECTRONICS CORP3 citations73
US9024386B2May 5, 2015
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP3 citations63
US8975699B2Mar 10, 2015
Semiconductor device
RENESAS ELECTRONICS CORP3 citations63
US8872267B2Oct 28, 2014
Semiconductor device
RENESAS ELECTRONICS CORP2 citations63
US9484271B2Nov 1, 2016
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations52
US9142567B2Sep 22, 2015
SOI SRAM having well regions with opposite conductivity
RENESAS ELECTRONICS CORP0 citations52
US8043918B2Oct 25, 2011
Semiconductor device and its manufacturing method
RENESAS ELECTRONICS CORP0 citations52
US9029237B2May 12, 2015
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations51