Inventor

WILLEKE REINER

DE3 patents

⚠️ This page may combine multiple inventors who share the name “WILLEKE REINER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES INC

2 patents

US9214436B2Dec 15, 2015

Etching of under bump mettallization layer and resulting device

GLOBALFOUNDRIES INC2 citations54

US9159683B2Oct 13, 2015

Methods for etching copper during the fabrication of integrated circuits

GLOBALFOUNDRIES INC0 citations41

WILLEKE REINER

1 patent

US9773744B2Sep 26, 2017

Solder bump cleaning before reflow

WILLEKE REINER7 citations67