Inventor

ATANASOVA TANYA

DE2 patents

Patents

2 patents

US9159683B2Oct 13, 2015

Methods for etching copper during the fabrication of integrated circuits

GLOBALFOUNDRIES INC0 citations41

US10236263B1Mar 19, 2019

Methods and structures for mitigating ESD during wafer bonding

GLOBALFOUNDRIES INC0 citations37