Inventor
LAI WING CHIU
HK3 patents
Patents
3 patentsUS10312214B2Jun 4, 2019
Atomization mechanism for cooling a bond head
ASM TECH SINGAPORE PTE LTD1 citations53
US10475763B2Nov 12, 2019
Die bonding apparatus comprising an inert gas environment
ASM TECH SINGAPORE PTE LTD0 citations31
US10192761B2Jan 29, 2019
Pick arm comprising a winged part for a bonding apparatus
ASM TECH SINGAPORE PTE LTD0 citations29