Inventor
JUNG WON DUCK
KR10 patents
Patents
10 patentsUS9345136B1May 17, 2016
Package substrates, semiconductor packages including the same, electronic systems including the same, and memory cards including the same
SK HYNIX INC7 citations82
US11233033B2Jan 25, 2022
Semiconductor packages including chips stacked on a base module
SK HYNIX INC0 citations59
US9543384B2Jan 10, 2017
Semiconductor package
SK HYNIX INC1 citations50
US10741529B2Aug 11, 2020
Semiconductor packages
SK HYNIX INC0 citations49
US10615129B2Apr 7, 2020
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
SK HYNIX INC0 citations49
US10224314B2Mar 5, 2019
Semiconductor packages
SK HYNIX INC0 citations49
US10157858B2Dec 18, 2018
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
SK HYNIX INC0 citations49
US12131997B2Oct 29, 2024
Semiconductor packages
SK HYNIX INC0 citations48
US9668344B2May 30, 2017
Semiconductor packages having interconnection members
SK HYNIX INC1 citations48
US10629543B2Apr 21, 2020
Package substrates having an electromagnetic bandgap structure and semiconductor packages employing the package substrates
SK HYNIX INC0 citations39