Inventor
ANG BOON Y
US13 patents
⚠️ This page may combine multiple inventors who share the name “ANG BOON Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
8 patentsUS10262911B1Apr 16, 2019
Circuit for and method of testing bond connections between a first die and a second die
XILINX INC51 citations92
US11379580B1Jul 5, 2022
Mixed storage of data fields
XILINX INC3 citations71
US11488887B1Nov 1, 2022
Thermal enablement of dies with impurity gettering
XILINX INC5 citations70
US11073550B1Jul 27, 2021
Test vehicle for package testing
XILINX INC5 citations70
US8810269B2Aug 19, 2014
Method of testing a semiconductor structure
XILINX INC3 citations60
US7839693B1Nov 23, 2010
Method of fabricating CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer
XILINX INC0 citations49
US10620644B1Apr 14, 2020
Systems and methods for on-die heat generation and temperature sensing
XILINX INC0 citations43
US10302504B1May 28, 2019
On-die temperature sensing and digitization system
XILINX INC0 citations39
ADVANCED MICRO DEVICES INC
3 patentsUS6830941B1Dec 14, 2004
Method and apparatus for identifying individual die during failure analysis
ADVANCED MICRO DEVICES INC44 citations91
US6995564B1Feb 7, 2006
Method and system for locating chip-level defects through emission imaging of a semiconductor device
ADVANCED MICRO DEVICES INC10 citations68
US6770495B1Aug 3, 2004
Method for revealing active regions in a SOI structure for DUT backside inspection
ADVANCED MICRO DEVICES INC2 citations62