Inventor

CHEN YING-JU

TW170 patents

⚠️ This page may combine multiple inventors who share the name “CHEN YING-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN YING-JU

TAIWAN SEMICONDUCTOR MFG CO LTD

Three-dimensional integrated circuit structures

Semiconductor structure

Devices employing thermal and mechanical enhanced layers and methods of forming same

Interconnect structure and method

Semiconductor structure and manufacturing method thereof

Semiconductor device including an embedded surface mount device and method of forming the same

Semiconductor structure and manufacturing method thereof

Package structure with photonic die and method

Devices employing thermal and mechanical enhanced layers and methods of forming same

Three-dimensional integrated circuit structures

Semiconductor structure

Supporting InFO packages to reduce warpage

Ring structures in device die

Semiconductor structure

Semiconductor packages and methods of forming the same

Semiconductor structure

Devices employing thermal and mechanical enhanced layers and methods of forming same

Ring structures in device die

Underfill control structures and method

Semiconductor package and forming method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacture

Structure and method for package warpage control using dummy interconnects

Capacitor in post-passivation structures and methods of forming the same

Devices employing thermal and mechanical enhanced layers and methods of forming same

Method for fabricating a chip package

Bonding to alignment marks with dummy alignment marks

Supporting InFO packages to reduce warpage

Structure and method for forming integrated high density MIM capacitor

Integrated circuits

TAIWAN SEMICONDUCTOR MFG

Semiconductor package including an embedded surface mount device and method of forming the same

Integrated circuit dies having alignment marks and methods of forming same

Methods and apparatus of packaging of semiconductor devices

Method of forming bump structure

Semiconductor devices having guard ring structure and methods of manufacture thereof

Contact pad for semiconductor devices

Method of making a semiconductor device having a post-passivation interconnect structure

Bump pad structure

Semiconductor test pad structures

CHEN HSIEN-WEI

Structure and method of forming a pad structure having enhanced reliability

Double solid metal pad with reduced area

Structure for improving die saw quality

Probe pad on a corner stress relief region in a semiconductor chip

TSAI HAO-YI

Bump pad structure

Inductor for post passivation interconnect

LIANG SHIH-WEI

Post-passivation interconnect structure

SHAO TUNG-LIANG

Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device

CHEN YING-JU

Method and system for filtering incoming messages to a mobile device

TAIWAN SEMICONDUCTOR MNAUFACTRUING COMPANY LTD

Semiconductor device and method of manufacture

UNIV CHUNG YUAN CHRISTIAN

Recombinant baculovirus vector and uses thereof