Inventor

SU CHIN-TA

TW34 patents

⚠️ This page may combine multiple inventors who share the name “SU CHIN-TA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SU CHIN-TA

MACRONIX INT CO LTD

Pad and method for chemical mechanical polishing

Method for improving the performance of flash memory

Ultraviolet blocking layer

Method of filling intervals and fabricating shallow trench isolation structures

Method of forming tunnel oxide layer

Method for forming a flash memory by using a microcrystalline polysilicon layer as a floating gate

Methods of forming planarized multilevel metallization in an integrated circuit

HDP-CVD process, filling-in process utilizing HDP-CVD, and HDP-CVD system

Method for improving the performance of flash memory by using microcrystalline silicon film as a floating gate

Interconnection process

HDPCVD process and method for improving uniformity of film thickness

Single chip pad oxide layer growth process

Method for controlling the properties of DARC and manufacturing DARC

UV blocking and crack protecting passivation layer

UV blocking and crack protecting passivation layer fabricating method

Semiconductor device comprising a surface portion implanted with nitrogen and fluorine

Conductive plug and method of forming the same

Semiconductor structure and method for manufacturing the same

Method of forming non-volatile memory cell

Chemical mechanical planarization process and structures

Contact barrier layer deposition process

Metal pad formation method and metal pad structure using the same

LUOH TUUNG

Semiconductor device having plural conductive layers disposed within dielectric layer

Multivariate monitoring method for plasma process machine

Method of forming a deposited material by utilizing a multi-step deposition/etch/deposition (D/E/D) process

Metal silicide formation

Method for fabricating conductive lines of a semiconductor device

Method of depositing a silicon-containing material by utilizing a multi-step fill-in process in a deposition machine

CHENG MING-DA

Isolation structure, non-volatile memory having the same, and method of fabricating the same

Isolation structure, non-volatile memory having the same, and method of fabricating the same

YEH CHIN-TSAN

Method of forming a semiconductor device

HUNG YUNG-TAI

Conductor removal process

LUO SHING ANN

Kink poly structure for improving random single bit failure

KO MENG TSUNG

System and method for semiconductor wafer processing with side/bevel protection