P

Inventor

HOLSCHER RICHARD D

US20 patents

Patents

20 patents
US6423474B1Jul 23, 2002

Use of DARC and BARC in flash memory processing

MICRON TECHNOLOGY INC272 citations98
US7538036B2May 26, 2009

Methods of forming openings, and methods of forming container capacitors

MICRON TECHNOLOGY INC36 citations92
US7408265B2Aug 5, 2008

Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates

MICRON TECHNOLOGY INC28 citations92
US7321149B2Jan 22, 2008

Capacitor structures, and DRAM arrays

MICRON TECHNOLOGY INC34 citations92
US7153778B2Dec 26, 2006

Methods of forming openings, and methods of forming container capacitors

MICRON TECHNOLOGY INC34 citations92
US6815308B2Nov 9, 2004

Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates

MICRON TECHNOLOGY INC16 citations92
US6432591B1Aug 13, 2002

Overlay target design method with pitch determination to minimize impact of lens aberrations

MICRON TECHNOLOGY INC14 citations92
US6107002AAug 22, 2000

Reducing resist shrinkage during device fabrication

MICRON TECHNOLOGY INC19 citations92
US6335531B1Jan 1, 2002

Modification of resist and/or resist processing with fluorescence detection

MICRON TECHNOLOGY INC16 citations79
US6756167B2Jun 29, 2004

Overlay target design method to minimize impact of lens aberrations

MICRON TECHNOLOGY INC4 citations73
US6469775B1Oct 22, 2002

Reticle for creating resist-filled vias in a dual damascene process

MICRON TECHNOLOGY INC5 citations73
US6417076B1Jul 9, 2002

Automated combi deposition apparatus and method

MICRON TECHNOLOGY INC10 citations72
US6403285B1Jun 11, 2002

Method for exposing semiconductor wafers in a manner that promotes radial processing uniformity

MICRON TECHNOLOGY INC9 citations72
US6639320B2Oct 28, 2003

Reticle for creating resist-filled vias in a dual damascene process

MICRON TECHNOLOGY INC2 citations62
US6514643B2Feb 4, 2003

Overlay target exposure device utilizing pitch determination to minimize impact of lens aberrations

MICRON TECHNOLOGY INC1 citations62
US6461778B1Oct 8, 2002

In-line method of measuring effective three-leaf aberration coefficient of lithography projection systems

MICRON TECHNOLOGY INC2 citations62
US6768213B2Jul 27, 2004

Automated combi deposition apparatus and method

MICRON TECHNOLOGY INC3 citations61
US7821142B2Oct 26, 2010

Intermediate semiconductor device structures

MICRON TECHNOLOGY INC0 citations52
US6812129B2Nov 2, 2004

Reticle for creating resist-filled vias in a dual damascene process

MICRON TECHNOLOGY INC0 citations52
US6580493B2Jun 17, 2003

Method and apparatus for exposing semiconductor wafers in a manner that promotes radial processing uniformity

MICRON TECHNOLOGY INC0 citations51