Inventor
LEE TAE-KOO
KR4 patents
Patents
4 patentsUS6835598B2Dec 28, 2004
Stacked semiconductor module and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD61 citations94
US5660318AAug 26, 1997
Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus
SAMSUNG ELECTRONICS CO LTD29 citations89
US6781849B2Aug 24, 2004
Multi-chip package having improved heat spread characteristics and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD18 citations83
US6326686B1Dec 4, 2001
Vertical semiconductor device package having printed circuit board and heat spreader, and module having the packages
SAMSUNG ELECTRONICS CO LTD12 citations71