Inventor
OHNO KANJI
JP4 patents
Patents
4 patentsUS6517894B1Feb 11, 2003
Method for plating a first layer on a substrate and a second layer on the first layer
EBARA CORP49 citations95
US6811658B2Nov 2, 2004
Apparatus for forming interconnects
EBARA CORP14 citations83
US6908534B2Jun 21, 2005
Substrate plating method and apparatus
EBARA CORP7 citations72
US6242624B1Jun 5, 2001
Method for making alkanol-or alkane-sulfone plumbate
EBARA CORP4 citations57